Copper Wire Bonding
by Preeti S Chauhan /
2013 / English / PDF
5.1 MB Download
This critical volume provides an in-depth presentation of copper
wire bonding technologies, processes and equipment, along with
the economic benefits and risks. Due to the increasing cost
of materials used to make electronic components, the electronics
industry has been rapidly moving from high cost gold to
significantly lower cost copper as a wire bonding material.
However, copper wire bonding has several process and
reliability concerns due to its material properties.
This critical volume provides an in-depth presentation of copper
wire bonding technologies, processes and equipment, along with
the economic benefits and risks. Due to the increasing cost
of materials used to make electronic components, the electronics
industry has been rapidly moving from high cost gold to
significantly lower cost copper as a wire bonding material.
However, copper wire bonding has several process and
reliability concerns due to its material properties.Copper Wire Bonding
Copper Wire Bonding book lays out the challenges
involved in replacing gold with copper as a wire bond material,
and includes the bonding process changes—bond force, electric
flame off, current and ultrasonic energy optimization, and
bonding tools and equipment changes for first and second bond
formation. In addition, the bond–pad metallurgies and the
use of bare and palladium-coated copper wires on aluminum are
presented, and gold, nickel and palladium surface finishes are
discussed. The book also discusses best practices and
recommendations on the bond process, bond–pad metallurgies, and
appropriate reliability tests for copper wire-bonded electronic
components.
book lays out the challenges
involved in replacing gold with copper as a wire bond material,
and includes the bonding process changes—bond force, electric
flame off, current and ultrasonic energy optimization, and
bonding tools and equipment changes for first and second bond
formation. In addition, the bond–pad metallurgies and the
use of bare and palladium-coated copper wires on aluminum are
presented, and gold, nickel and palladium surface finishes are
discussed. The book also discusses best practices and
recommendations on the bond process, bond–pad metallurgies, and
appropriate reliability tests for copper wire-bonded electronic
components.
In summary, this book:
In summary, this book:Introduces copper wire bonding technologies
Introduces copper wire bonding technologiesPresents copper wire bonding processes
Presents copper wire bonding processesDiscusses copper wire bonding metallurgies
Discusses copper wire bonding metallurgiesCovers recent advancements in copper wire bonding including
the bonding process, equipment changes, bond–pad materials and
surface finishes
Covers recent advancements in copper wire bonding including
the bonding process, equipment changes, bond–pad materials and
surface finishesCovers the reliability tests and concerns
Covers the reliability tests and concernsCovers the current implementation of copper wire bonding in
the electronics industry
Covers the current implementation of copper wire bonding in
the electronics industry Features 120 figures and tables
Features 120 figures and tablesCopper Wire Bonding
Copper Wire Bonding is an essential reference for industry
professionals seeking detailed information on all facets of
copper wire bonding technology.
is an essential reference for industry
professionals seeking detailed information on all facets of
copper wire bonding technology.