Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment, And Reliability
by Kim S. Siow /
2019 / English / PDF
12.3 MB Download
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.
Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials
Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium
Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
