Handbook Of Semiconductor Interconnection Technology, Second Edition
by Geraldine C. Schwartz /
2006 / English / PDF
3.2 MB Download
First introduced about a decade ago, the first edition of the
First introduced about a decade ago, the first edition of theHandbook of Semiconductor Interconnection
Technology
Handbook of Semiconductor Interconnection
Technology became widely popular for its thorough,
integrated treatment of interconnect technologies and its
forward-looking perspective. The field has grown tremendously in
the interim and many of the "likely directions" outlined in the
first edition are now standard in modern facilities. Reflecting
those advances, this edition delves into the practical aspects of
interconnections for manufacturing. It examines the interconnect
and fabrication technologies now available, with an examination of
future prospects for the field.
became widely popular for its thorough,
integrated treatment of interconnect technologies and its
forward-looking perspective. The field has grown tremendously in
the interim and many of the "likely directions" outlined in the
first edition are now standard in modern facilities. Reflecting
those advances, this edition delves into the practical aspects of
interconnections for manufacturing. It examines the interconnect
and fabrication technologies now available, with an examination of
future prospects for the field.What's in
this Edition:
What's in
this Edition:Detailed discussion of electrochemical equipment for plating
copper
Detailed discussion of electrochemical equipment for plating
copperInformation on tools used for evaporation, chemical vapor
deposition, and plasma processes
Information on tools used for evaporation, chemical vapor
deposition, and plasma processesEmphasis on measurement of mechanical and thermal properties
of insulators
Emphasis on measurement of mechanical and thermal properties
of insulatorsMethods for characterizing porous dielectric thin films
Methods for characterizing porous dielectric thin filmsGreater focus on integration issues and properties of
titanium, cobalt, and nickel silicides
Greater focus on integration issues and properties of
titanium, cobalt, and nickel silicidesProcess schemes based on the increased need for borderless
contact gates and source/drain
Process schemes based on the increased need for borderless
contact gates and source/drainExpanded discussion on choices for low-dielectric
insulators
Expanded discussion on choices for low-dielectric
insulatorsConcentration on electroplated copper, especially morphology
of plated films and their properties
Concentration on electroplated copper, especially morphology
of plated films and their propertiesDevelopments in thin film liners and barriers
Developments in thin film liners and barriersExpanded material on copper reliability
Expanded material on copper reliability
