Handbook Of Vlsi Microlithography, 2nd Edition, Second Edition
by John N. Helbert /
2002 / English / PDF
6.4 MB Download
This handbook gives readers a close look at the entire technology
of printing very high resolution and high density integrated
circuit (IC) patterns into thin resist process transfer
coatingsùincluding optical lithography, electron beam, ion beam,
and x-ray lithography. The book's main theme is the special
printing process needed to achieve volume high density IC chip
production, especially in the Dynamic Random Access Memory (DRAM)
industry. The book leads off with a comparison of various
lithography methods, covering the three major patterning parameters
of line/space, resolution, line edge and pattern feature dimension
control. The book's explanation of resist and resist process
equipment technology may well be the first practical description of
the relationship between the resist process and equipment
parameters. The basics of resist technology are completely
coveredùincluding an entire chapter on resist process defectivity
and the potential yield limiting effect on device production.
This handbook gives readers a close look at the entire technology
of printing very high resolution and high density integrated
circuit (IC) patterns into thin resist process transfer
coatingsùincluding optical lithography, electron beam, ion beam,
and x-ray lithography. The book's main theme is the special
printing process needed to achieve volume high density IC chip
production, especially in the Dynamic Random Access Memory (DRAM)
industry. The book leads off with a comparison of various
lithography methods, covering the three major patterning parameters
of line/space, resolution, line edge and pattern feature dimension
control. The book's explanation of resist and resist process
equipment technology may well be the first practical description of
the relationship between the resist process and equipment
parameters. The basics of resist technology are completely
coveredùincluding an entire chapter on resist process defectivity
and the potential yield limiting effect on device production.
Each alternative lithographic technique and testing method is
considered and evaluated: basic metrology including optical,
scanning-electron-microscope (SEM) techniques and electrical test
devices, along with explanations of actual printing tools and their
design, construction and performance. The editor devotes an entire
chapter to today's sophisticated, complex electron-beam printers,
and to the emerging x-ray printing technology now used in
high-density CMOS devices. Energetic ion particle printing is a
controllable, steerable technology that does not rely on resist,
and occupies a final section of the handbook.
Each alternative lithographic technique and testing method is
considered and evaluated: basic metrology including optical,
scanning-electron-microscope (SEM) techniques and electrical test
devices, along with explanations of actual printing tools and their
design, construction and performance. The editor devotes an entire
chapter to today's sophisticated, complex electron-beam printers,
and to the emerging x-ray printing technology now used in
high-density CMOS devices. Energetic ion particle printing is a
controllable, steerable technology that does not rely on resist,
and occupies a final section of the handbook.