Solder Paste In Electronics Packaging: Technology And Applications In Surface Mount, Hybrid Circuits, And Component Assembly
by Jennie Hwang /
1992 / English / PDF
16.7 MB Download
One of the strongest trends in the design and manufacture of modern
electronics packages and assemblies is the utilization of surface
mount technology as a replacement for through-hole tech nology.
The mounting of electronic devices and components onto the surface
of a printed wiring board or other substrate offers many advantages
over inserting the leads of devices or components into holes. From
the engineering viewpoint, much higher lead counts with shorter
wire and interconnection lengths can be accommo dated. This is
critical in high performance modern electronics packaging. From the
manufacturing viewpoint, the application of automated assembly and
robotics is much more adaptable to high lead count surface mounted
devices and components. Indeed, the insertion of high lead count
parts into fine holes on a substrate might often be nearly
impossible. Yet, in spite of these surface mounting advantages, the
utilization of surface mount technology is often a problem,
primarily due to soldering problems. The most practical soldering
methods use solder pastes, whose intricacies are frequently not
understood by most of those involved in the engineering and
manufacture of electronics assemblies. This publication is the
first book devoted exclusively to explanations of the broad
combination of the chemical, metallurgical, and rheological
principles that are critical to the successful use of solder
pastes. The critical relation ships between these characteristics
are clearly explained and pre sented. In this excellent
presentation, Dr. Hwang highlights three impor tant areas of
solder paste technology.
One of the strongest trends in the design and manufacture of modern
electronics packages and assemblies is the utilization of surface
mount technology as a replacement for through-hole tech nology.
The mounting of electronic devices and components onto the surface
of a printed wiring board or other substrate offers many advantages
over inserting the leads of devices or components into holes. From
the engineering viewpoint, much higher lead counts with shorter
wire and interconnection lengths can be accommo dated. This is
critical in high performance modern electronics packaging. From the
manufacturing viewpoint, the application of automated assembly and
robotics is much more adaptable to high lead count surface mounted
devices and components. Indeed, the insertion of high lead count
parts into fine holes on a substrate might often be nearly
impossible. Yet, in spite of these surface mounting advantages, the
utilization of surface mount technology is often a problem,
primarily due to soldering problems. The most practical soldering
methods use solder pastes, whose intricacies are frequently not
understood by most of those involved in the engineering and
manufacture of electronics assemblies. This publication is the
first book devoted exclusively to explanations of the broad
combination of the chemical, metallurgical, and rheological
principles that are critical to the successful use of solder
pastes. The critical relation ships between these characteristics
are clearly explained and pre sented. In this excellent
presentation, Dr. Hwang highlights three impor tant areas of
solder paste technology.
