Crosstalk In Modern On-chip Interconnects: A Fdtd Approach (springerbriefs In Applied Sciences And Technology)
by B.K. Kaushik /
2016 / English / PDF
4.6 MB Download
The book provides accurate FDTD models for on-chip interconnects,
covering most recent advancements in materials and design.
Furthermore, depending on the geometry and physical
configurations, different electrical equivalent models for CNT
and GNR based interconnects are presented. Based on the
electrical equivalent models the performance comparison among the
Cu, CNT and GNR-based interconnects are also discussed in the
book. The proposed models are validated with the HSPICE
simulations.
The book provides accurate FDTD models for on-chip interconnects,
covering most recent advancements in materials and design.
Furthermore, depending on the geometry and physical
configurations, different electrical equivalent models for CNT
and GNR based interconnects are presented. Based on the
electrical equivalent models the performance comparison among the
Cu, CNT and GNR-based interconnects are also discussed in the
book. The proposed models are validated with the HSPICE
simulations.The book introduces the current research scenario in the
modeling of on-chip interconnects. It presents the structure,
properties, and characteristics of graphene based on-chip
interconnects and the FDTD modeling of Cu based on-chip
interconnects. The model considers the non-linear effects of CMOS
driver as well as the transmission line effects of interconnect
line that includes coupling capacitance and mutual inductance
effects. In a more realistic manner, the proposed model includes
the effect of width-dependent MFP of the MLGNR while taking into
account the edge roughness.
The book introduces the current research scenario in the
modeling of on-chip interconnects. It presents the structure,
properties, and characteristics of graphene based on-chip
interconnects and the FDTD modeling of Cu based on-chip
interconnects. The model considers the non-linear effects of CMOS
driver as well as the transmission line effects of interconnect
line that includes coupling capacitance and mutual inductance
effects. In a more realistic manner, the proposed model includes
the effect of width-dependent MFP of the MLGNR while taking into
account the edge roughness.